Inqubo yokwenza isikrini se-smartphone esigoqekayo

Inqubo yokwenza isikrini se-smartphone esigoqekayo

Intuthuko yama-smartphone eminyakeni yamuva nje ayigxilanga nje ekuthuthukisweni kwekhamera noma ekusebenzeni kweprosesa, kodwa futhi nasekuthuthukisweni komklamo. Enye yezinto ezithokozisayo kakhulu ukufika kwama-smartphone anezibonisi ezigoqekayo. Ngemuva kwale mikhiqizo ebukeka njengeyesikhathi esizayo kunenqubo yokukhiqiza eyinkimbinkimbi, enembile kakhulu ehilela izendlalelo eziningi zezinto ezithuthukisiwe. Lesi sihloko sixoxa ngendlela izibonisi zama-smartphone ezigoqekayo ezidalwe ngayo, kusukela ekukhetheni izinto kuya ekuhlolweni kokuqina ngaphambi kokuba zikhishwe.

1. Umqondo oyisisekelo wesikrini esigoqekayo: esiguquguqukayo, hhayi nje esincane

Ngokungafani nezikrini ze-smartphone ezivamile ezisebenzisa ingilazi eqinile, izikrini ezigoqekayo kumele zikwazi ukugoba izinkulungwane ziye ezinkulungwaneni zezikhathi ngaphandle komonakalo omkhulu, kungaba ekubonisweni okubonakalayo noma emsebenzini wokuthinta. Ngakho-ke, umongo wesikrini esigoqekayo yiphaneli yokubonisa eguquguqukayo, ngokuvamile esekelwe ku-OLED (Organic Light Emitting Diode). Ubuchwepheshe be-OLED buvumela iphikseli ngayinye ukuthi ikhiphe ukukhanya kwayo ngaphandle kokukhanya kwangemuva, okuvumela isakhiwo sesikrini ukuba senziwe sibe sincane futhi siguquguquke kakhulu kune-LCD.

Kodwa-ke, ukuguquguquka kukodwa akwanele. Isikrini kumele futhi singaklwebhi, singaqhekeki, futhi sikhululekile ukusisebenzisa. Inselele enkulu ivela endaweni egobile, lapho izinto zibhekana khona nokucindezeleka okukhulu kakhulu komshini.

2. Ukwakhiwa kwezindawo zangemuva eziguquguqukayo kanye nezendlalelo ze-elekthronikhi

Inqubo yokukhiqiza iphaneli ye-OLED eguquguqukayo iqala ngokwakhiwa kwe-backplane, ungqimba oluqukethe ama-transistors e-thin-film (TFTs) alawula ukuvulwa kwamaphikseli. Ezibonisweni eziguquguqukayo, le backplane ayakhelwe engilazini njengephaneli evamile, kodwa kunalokho yakhelwe kwi-substrate ekhethekile, engashisi ukushisa, njenge-polyimide (PI). I-Polyimide ikhethwa ngoba ingamelana namazinga okushisa aphezulu ezinqubo zokubeka kanye ne-lithography ngenkathi ihlala iguquguqukayo ngemva kokuqedwa.

Lesi sigaba ngokuvamile sihilela izinqubo ezifana nalezi:
– Isembozo se-substrate: kufakwa ungqimba lwe-polyimide olunobukhulu obuthile.
– Ukupholisa (ukushisa): ukuqinisa isakhiwo nokwandisa ukuzinza kobukhulu.
– I-Photolithography kanye nokuqopha: ukwakha amaphethini wesekethe ye-TFT nge-microscope.
– Ukufakwa kwezingqimba zomqhubi kanye nezesivikelo: ukuze ugesi ku-pixel ngayinye ukwazi ukulawulwa ngokunembile.

FUNDA  Ukuklama nokukhiqizwa kwama-smartphone ngezinto ezinobungani nemvelo

Ukunemba kulesi sigaba kubaluleke kakhulu njengoba ukungapheleli okuncane kungabangela amaphikseli afile noma umehluko ekukhanyeni.

3. Ukufakwa kwesendlalelo se-OLED: inhliziyo yesibonisi

Uma i-backplane isiqediwe, ungqimba lwe-OLED luyangezwa. Ama-OLED aqukethe izendlalelo eziningana ezincane kakhulu eziphilayo, ngayinye enomsebenzi othize: ungqimba lokujova nge-electron, ungqimba lokukhipha ukukhanya, kanye nesendlalelo sokuthutha imigodi. Lezi zendlalelo zifakwa e-backplane kusetshenziswa amasu okubeka njenge-vacuum evaporation noma ezinye izindlela ezigcina amazinga aphezulu okuhlanzeka.

Le nqubo ivame ukwenziwa ekamelweni le-vacuum elinokulawulwa okuqinile kwezinhlayiya zothuli, njengoba ngisho nokungcola okuncane kakhulu kungalimaza iphaneli. Lesi sigaba sihilela nokwakheka kwamaphethini e-subpixel abomvu, aluhlaza okotshani, naluhlaza okwesibhakabhaka. Enye indlela evame ukusetshenziswa ukusetshenziswa kwemaski yensimbi encane (i-FMM), uhlobo lwe-"stencil" ecolekile kakhulu ukudala amaphethini ombala.

4. Ukufakwa kwe-encapsulation: kuvikela i-OLED ezitheni ezinkulu

Izendlalelo ze-OLED zizwela kakhulu emanzini kanye nomoya-mpilo. Ukuchayeka emswakama kungabangela ukuwohloka, amabala amnyama, ngisho nokwehluleka kwephaneli. Ngakho-ke, uma ungqimba lwe-OLED seluqediwe, isibonisi kumele sivikelwe ngenqubo yokufaka i-capsulation.

Ezibukweni ezigoqekayo, ukufakwa kwe-capsulation akukwazi ukusebenzisa ingilazi ejiyile njengamaphaneli avamile. Abakhiqizi basebenzisa i-Thin Film Encapsulation (TFE), equkethe izendlalelo ezincane ezishintshashintshayo: izinto ezingaphili njengesithiyo kanye nezinto eziphilayo njenge-absorber yokucindezeleka. Lesi sakhiwo esinezendlalelo senzelwe ukuhlala siguquguquka lapho sigobile ngenkathi sisavimbela umswakama ukuthi ungene.

Inqubo ye-TFE idinga ukulawulwa kobukhulu obunembile kakhulu kanye nokuhlolwa kwekhwalithi okuphindaphindiwe, njengoba ngisho nokuvuza okuncane kunganciphisa kakhulu isikhathi sokuphila kwephaneli.

5. Isendlalelo sokuthinta esingagoba

Izibonisi ze-smartphone ezigoqekayo azibonisi nje kuphela izithombe kodwa futhi zidinga ukuphendula ekuthinteni. Yilapho kudingeka khona ungqimba lwenzwa yokuthinta eguquguqukayo. Izinzwa zokuthinta zivame ukwenziwa ngezinto ezibonakalayo neziqhubayo njenge-ITO (Indium Tin Oxide). Kodwa-ke, i-ITO iyaqina uma igobile ngokuphindaphindiwe, ngakho abanye abakhiqizi basebenzisa ezinye izindlela ezifana ne-mesh yensimbi noma ezinye izinto zokuhambisa eziguquguqukayo.

FUNDA  Izinto zokwakha amakheyiji e-smartphone

Ingqimba yokuthinta ibe isinamathiselwa kuphaneli yokubonisa kusetshenziswa ingcina ebonakalayo ebonakalayo (i-OCA/LOCA), okumele ingabi namabhamuza futhi ivimbele ukuphambuka kombala. Le nqubo yokubopha idinga ingcindezi efanayo kanye nendawo ehlanzekile ukuvimbela uthuli oluvalelekile.

6. Isembozo sesikrini: I-UTG nefilimu yokuvikela

Ukuze isikrini singaklwebheki, ama-smartphone anamuhla asongekayo ngokuvamile asebenzisa izindlela ezimbili:
1. UTG (Ingilazi Encane Kakhulu): ingilazi encane kakhulu engagoba ngezinga elithile.
2. Ifilimu ye-polymer evikelayo: ungqimba oluphezulu oluvame ukubonakala “njengomvikeli wesikrini” ofakwe efektri.

I-UTG yenziwa ngenqubo ekhethekile ehlanganisa ukunciphisa ingilazi, ukuqinisa amakhemikhali, kanye nokusika ngokunemba. Le ngilazi incane kakhulu kunengilazi evamile ye-smartphone, kodwa isanikeza umuzwa oqinile kunepulasitiki emsulwa.

Ngemva kokufakwa kwe-UTG, abakhiqizi bafaka ifilimu ekhethekile yokuvikela esiza ukunciphisa ingozi yokuklwebheka kanye nokuqhekeka okuncane. Lezi zendlalelo zifakwa nge-lamination enembile kakhulu, njengoba ngisho nephutha elincane kakhulu lingabangela ukugoba noma lenze isikrini sizwakale singalingani uma sithinta.

7. Ukuhlanganiswa nama-hinges nohlaka: isihluthulelo sesipiliyoni sokugoqa

Izikrini ezigoqekayo zixhunywe ngokungenakuhlukaniswa nomklamo wezihibe. Izihibe zinquma irediyasi yokugoqa, inani lokucindezela kuphaneli, kanye nobubanzi bokugoqa okubonakalayo. Lapho benamathisela isikrini kufreyimu, abakhiqizi baqinisekisa ukuthi:
– isikrini sisekelwa ngokulinganayo,
– indawo yokugoqa inendawo eyanele yokuhamba,
– ingcindezi lapho ivala ayilimazi ulwelwesi lwangaphakathi.

Eminye imiklamo yesimanje yehinge izama nokunciphisa igebe lapho ifoni igoqwa ukuze kuvinjelwe uthuli ukuthi lungangeni. Uthuli luyisitha esikhulu sezikrini ezigoqekayo, njengoba izinhlayiya ezincane zingacindezela iphaneli ngaphakathi futhi zishiye amamaki ahlala njalo.

8. Ukuhlolwa kwekhwalithi: kusukela ekugoqweni okuphindaphindiwe kuya ekushiseni okukhulu

Ngaphambi kokuba zithengiswe, izibonisi ezigoqekayo zidlula ochungechungeni lokuhlolwa kokuqina okuqinile. Lokhu kuhlolwa kuhlose ukuqinisekisa ukuthi isibonisi sihlala sisebenza ngaphansi kokusetshenziswa isikhathi eside. Ezinye izivivinyo ezivamile zifaka:
– Ukuhlolwa kokukhuthazela kokugoqa: umshini ugoqa isikrini izikhathi ezingamashumi kuya kwezingamakhulu ezinkulungwane.
- Ukuhlolwa kwezinga lokushisa nomswakama: kulingisa izimo zomsebenzisi ezimweni ezahlukene zezulu.
– Ukuhlolwa kokucindezela kanye nokugoba: kuhlola ukumelana nokucindezela esikhwameni noma ephaketheni.
– Ukuhlolwa kokuklwebha: kulinganisa ukumelana kwengqimba ephezulu nezinto ezicijile.
– Ukuhlolwa kokufana kokubonisa: kuhlola ukufana kombala, ukukhanya, namaphikseli afile.

FUNDA  Ubuchwepheshe bokukhiqiza amakhamera angaphansi kwesikrini

Uma kutholakala amaphutha afana nemigqa emincane, izindawo ezifiphazayo, noma izindawo zokuthinta ezingaphenduli, iphaneli izohlukaniswa futhi ihlaziywe ukuze kutholakale umthombo wenkinga, kungaba kusukela ekufakweni kwe-capsulation, i-lamination, noma i-backplane.

9. Izinselele zokukhiqiza kanye neziqondiso zokusungula izinto ezintsha

Ukukhiqizwa kwesikrini esigoqekayo kuhlala kunzima futhi kubiza kakhulu kunezibonisi ezivamile. Izinga lokukhiqiza lingaba phezulu ngoba izendlalelo eziningi kumele ziqondaniswe kahle ngenkathi zihlala ziguquguquka. Ngaphezu kwalokho, ukwakheka kwama-crease kusalokhu kuyinkinga eqhubekayo ukuxazululwa.

Kusukela manje, ukusungula izinto ezintsha kulindeleke ukuthi kuholele ku:
– izinto zokuvikela eziqinile kodwa eziguquguqukayo,
– isakhiwo sehinge esicindezela ukugoqa okuncane,
- izinzwa zokuthinta kanye nezendlalelo zokuvala ezihlala isikhathi eside,
– kanye nokuthuthukiswa kwezikrini ezigoqekayo ezidinga ukuguquguquka okukhulu.

Isiphetho

Inqubo yokukhiqiza isibonisi se-smartphone esigoqekayo iyinhlanganisela eyinkimbinkimbi kakhulu yobuchwepheshe bokubonisa, isayensi yezinto zokwakha, kanye nobunjiniyela bemishini. Kusukela ku-substrate ye-polyimide ye-backplane, kuya ekubekweni kwesendlalelo se-OLED esibucayi, kuya ekufakweni okuncane kokuvikela umswakama, kuya ekufakweni kwe-UTG nokuhlanganiswa ne-hinge, konke kudinga ukunemba okuphezulu. Impumelelo ye-smartphone egoqekayo ayinqunywa kuphela ukwakheka kwangaphandle, kodwa futhi nekhwalithi yokukhiqiza isibonisi, esingamelana nezinkulungwane zezimbobo ngenkathi sisabonisa izithombe ezibukhali kanye nempendulo enembile yokuthinta.

Uma ungathanda, ngingenza futhi inguqulo yobuchwepheshe yalesi sihloko (ngokulandelana kwenqubo efana neyasefekthri) noma inguqulo elula yomfundi ojwayelekile.